AMEC Introduces the Primo Nanova® System - PR Newswire

SHANGHAI, March 12, 2018 /PRNewswire/ -- This week at SEMICON China, Advanced Micro-Fabrication Equipment Inc. (AMEC) formally unveiled the ... SendaRelease ALLCONTACTINFO ContactUs 888-776-0942 from8AM-10PMET SendaRelease SignUp LogIn Resources Blog Journalists RSS GDPR NewsinFocus BrowseAllNews MultimediaGallery TrendingTopics Business&Money Auto&Transportation BusinessTechnology Entertain­ment&Media FinancialServices&Investing GeneralBusiness Science&Tech ConsumerTechnology Energy&NaturalResources Environ­ment HeavyIndustry&Manufacturing Telecomm­unications Lifestyle&Health ConsumerProducts&Retail Entertain­ment&Media Health Sports Travel Policy&PublicInterest People&Culture People&Culture SendaRelease SignUp LogIn Resources Blog Journalists RSS GDPR Overview DistributionbyPRNewswire CisionCommunicationsCloud® CisionIR AllProducts SendaRelease SignUp LogIn Resources Blog Journalists RSS GDPR GeneralInquiries RequestaDemo EditorialBureaus Partnerships MediaInquiries WorldwideOffices SendaRelease SignUp LogIn Resources Blog Journalists RSS GDPR SHANGHAI,March12,2018/PRNewswire/--ThisweekatSEMICONChina,AdvancedMicro-FabricationEquipmentInc.(AMEC)formallyunveiledthePrimonanova®system(nanova)-thecompany'sfirstinductivelycoupledplasma(ICP)etcherforhigh-volumefront-endproductionofmemoryandlogicICs.ThesystemcombinesproprietaryICPtechnologyinnovationsandnovelfeaturestohelpcustomersachieveapplicationimperativesliketightcriticaldimension(CD)uniformityandsuperiorcontrol.Keydifferentiationsincludeaspecializedsymmetricchamberconfigurationthatenablesveryhighpumpingspeed,aswellasanovellow-capacitivecouplingcoildesign,andatemperature-controlledmultiple-zoneelectrostaticchuck(ESC).Withtheseandotheruniquefeatures,thesystemdeliverssuperiorprocessperformanceforcriticalconductoranddielectricetchapplicationsatdevicenodesof5nmandbelow,atacostofownership(CoO)thatissignificantlylowerthancomparativetools. AMEC’sPrimonanova®ICPetchsystem AMEChasreceivedordersforthenanovasystemfrommultiplecustomers.Productshavebeenshippedandthefirsttoolisalreadyinproductionanddemonstratingverystableyield.Thecompanyisnowacceleratingdemorequests.ThesystemstrengthensAMEC'sportfolioofetchtoolswhichincludesmulti-generationcapacitivelycoupledplasma(CCP)dielectricandTSVetchproductfamilies. Thenanovasystemwasengineeredtoaddresstoday'sICmanufacturingcomplexitieswherenewmaterials,newtransistorstructures,doubleandevenquadruplepatterning,andothertechnologyadvancementsarehelpingtoensurecontinueddeviceshrinks.Criticalsuccessimperativesforetchinthisprocessingenvironmentarehighuniformityandsuperiorcontrolacrossthewafer,withwideprocesswindow.Thenanovasystemmeetsthesetechnicalrequirementsinacost-effectivesingle-stationchambertool.      "Thenanovasystemdeploystoday'smostadvancedetchtechnologytoempowercustomersattheleadingedgewithenablinginnovationandexceptionalflexibility,"saidDr.TomNi,VPandGMofAMEC'sEtchProductBusinessGroup."Thesystemcanprocessdiverseconductoretchapplications,likeSTI,poly-gate,spacer,masketchingandetch-back,withindustry-leadingproductivityandsuperioron-waferperformance.AsanICP-basedtechnology,itcanetchdeepverticalholes,aswellasshallowtaperedfeatures.It'sacost-competitivesolutionaswell,thankstoasmaller-than-averagefootprintandaninnovativedesignthatreducesconsumablesuse.We'reexcitedtoseecustomersalreadybenefitingfromthetool."ThePrimonanovaSystem:KeyEnablingAttributesandAdvantagesThesix-chambertoolwithtwoloadlockstrippersfeaturesproprietaryinnovationsthatcollectivelyenablehigherproductivityandgreaterthroughput.Theyinclude: Aproprietarylow-capacitivecouplingcoildesignthatenablesmoreindependentiondensityandenergywhichisessentialforhigherselectivityandsoftetch; Asymmetricchamberdesignfeaturingamulti-zoneESCandactive-edgetiltingcontrolforbetteruniformity.AMECengineeredthedesigntoovercomeside-to-sidenon-uniformitywhichhasbeenapersistentchallengeinhigh-volumemanufacturing; Wideprocesswindowandpreciselocalizedprofilecontrolwithsignificantlyhigherpumpingspeedwhencomparedtosimilarproducts; Innovativeplasma-enhancedPVDcoating,coupledwithprecisechamberwalltemperatureandsuperiorchamberenvironmentcontrolforgreaterprocessstabilityanddefectreduction. Dr.Nifurthernoted:"Feedbackfromcustomersconfirmsthatthenanovasystemdeliverstheon-waferperformanceandproductivityweintended,andwithcompellingCoObenefits.It'saflexibletoolthatisequippedtoprocessdiverseapplicationswithminimalconfigurationadjustments."PrimonanovaisatrademarkofAdvancedMicro-FabricationEquipmentInc.AdvancedMicro-FabricationEquipmentInc.(AMEC)AMECisChina'sleadingproviderofadvancedprocesstechnologytoglobalmanufacturersofsemiconductorsandsolid-statelighting(SSL)products.HeadquarteredinShanghai,thecompanyisanentrenchedsupplierofdielectricandTSVEtchtools,helpingchipmakersbuilddevicesatprocessnodesaslowas7nm.Todate,nearly800AMECprocessunitshavebeenpositionedat40leading-edgesemiconductorfabsacrossAsia.ThecompanyisalsowellestablishedinEuropewithAMECMEMStoolsrunninginproductionatmajorIDMs.Inaddition,withitsMOCVDsystem,thecompanyhelpsSSLmanufacturersbuildtoday'smostadvancedLEDproducts.TolearnmoreaboutAMEC,pleasevisitwww.amec-inc.com.SOURCEAdvancedMicro-FabricationEquipmentInc.RelatedLinkshttp://www.amec-inc.com × Modaltitle