美國再出新規制裁華為，如計劃屬實，中方將予以強力反擊

昨日，美國政府突然宣布即將升級制裁措施，準備阻止全球所有晶片製造商向華為公司輸出半導體元件。

此事影響廣泛，中美貿易戰將再次升級。

美國商務部正擴大對華為的制裁力度，試圖切斷其與全球晶片商的聯繫

美國此次的計劃可以理解為，全世界所有的公司只要在和華為合作的業務中，使用了一定比例的美國技術和設備，就必須通過美國政府的批准。

由於海思麒麟晶片和高通、蘋果一樣，都是通過台灣台積電（TSMC）等晶片代工廠生產晶片產品，所以此舉可能導致下半年的華為Mate40系列手機無法生產。

而華為在2019年的晶片採購金額上達到了208億美元，僅次於蘋果和三星的361億美元和334億美元。

如若真撕破臉，全球的晶片行業都要受到很大程度的影響。

美國商務部置頂公告

該公告5月15日正式生效，在5月15日前的訂單不受限制，但是必須在120日之內發貨完畢，從根本上杜絕了華為公司提前備貨的可能性。

此舉不僅是美國政府針對華為企業的單一行為，近期接下麒麟710A處理器代工業務的中芯國際也恐受影響。

中國掌握了大量5G核心技術，目前，美國的晶片廠商高通公司在中國的收入，占其整個公司的60％。

中國高科技產業並非「砧上魚肉」，可以任人宰割

The Bureau of Industry and Security (BIS) today announced plans to protect U.S. national security by restricting Huawei’s ability to use U.S. technology and software to design and manufacture its semiconductors abroad. This announcement cuts off Huawei’s efforts to undermine U.S. export controls. BIS is amending its longstanding foreign-produced direct product rule and the Entity List to narrowly and strategically target Huawei’s acquisition of semiconductors that are the direct product of certain U.S. software and technology.

Since 2019 when BIS added Huawei Technologies and 114 of its overseas-related affiliates to the Entity List, companies wishing to export U.S. items were required to obtain a license.[1] However, Huawei has continued to use U.S. software and technology to design semiconductors, undermining the national security and foreign policy purposes of the Entity List by commissioning their production in overseas foundries using U.S. equipment.

「Despite the Entity List actions the Department took last year, Huawei and its foreign affiliates have stepped-up efforts to undermine these national security-based restrictions through an indigenization effort. However, that effort is still dependent on U.S. technologies,」 said Secretary of Commerce Wilbur Ross. 「This is not how a responsible global corporate citizen behaves. We must amend our rules exploited by Huawei and HiSilicon and prevent U.S. technologies from enabling malign activities contrary to U.S. national security and foreign policy interests.」

Specifically, this targeted rule change will make the following foreign-produced items subject to the Export Administration Regulations (EAR):

(i) Items, such as semiconductor designs, when produced by Huawei and its affiliates on the Entity List (e.g., HiSilicon), that are the direct product of certain U.S. Commerce Control List (CCL) software and technology; and

(ii) Items, such as chipsets, when produced from the design specifications of Huawei or an affiliate on the Entity List (e.g., HiSilicon), that are the direct product of certain CCL semiconductor manufacturing equipment located outside the United States. Such foreign-produced items will only require a license when there is knowledge that they are destined for reexport, export from abroad, or transfer (in-country) to Huawei or any of its affiliates on the Entity List.

To prevent immediate adverse economic impacts on foreign foundries utilizing U.S. semiconductor manufacturing equipment that have initiated any production step for items based on Huawei design specifications as of May 15, 2020, such foreign-produced items are not subject to these new licensing requirements so long as they are reexported, exported from abroad, or transferred (in-country) by 120 days from the effective date.

Federal Register notice of the interim final rule is available here.

美商務部置頂公告原文