TSMC Releases 16nm FinFET Design Flows | EE Times
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TSMC's 3D-IC design flow addresses such items as through-transistor-stacking (TTS) technology; through silicon vias (TSVs) plus microbumps, back-side metal ... //phpechodo_shortcode('[ac-cookieless-ga]');?> EETimes-TSMCReleases16nmFinFETDesignFlows
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