WLCSP package
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- 1晶圓級封裝(WLCSP) & 倒片封裝(Flip-Chip)_光刻人的世界
晶圓級封裝(WLCSP) & 倒片封裝(Flip-Chip) ... 吧,所以必須在Wafer還沒切割之前就做完這個process,所以就叫做Wafer Level CSP封裝了(WLCSP)。
- 2晶圓級晶片尺寸封裝 - Chipbond Website
WLCSP 少掉基材、銅箔等,使其以晶圓形態進行研磨、切割後完成的IC厚度和一般QFP、BGA……等等比較起來為最薄、最小、最輕,較符合未來產品 ... Ball mount process f...
- 3AN3846 - Wafer Level Chip Scale Package (WLCSP) - NXP
This process is an extension of the wafer Fab process, where the device interconnects and protect...
- 4智原科技-WLCSP測試與Bumping流程 - Faraday Technology ...
Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the...
- 5WLCSP - Wafer Level Chip Scale Package - JCET Group
Minimum available flip chip bump pitch of 150µm. • Large bump (220-500µm) processing at 0.35mm pi...