智原科技-WLCSP測試與Bumping流程 - Faraday Technology ...
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Wafer Level Chip Scale Package refers to the technology of packaging an integrated circuit at the wafer level, instead of the traditional process of ... WaferLevelChipScalePackagereferstothetechnologyofpackaginganintegratedcircuitatthewaferlevel,insteadofthetraditionalprocessofassemblingindividualunitsinpackagesafterdicingthemfromawafer.ThisprocessisbasicallyanextensionofthewaferFabprocesses,wherethedeviceinterconnectsandprotectionareaccomplishedusingthetraditionalfabprocessesandtools.Inthefinalform,thedeviceisessentiallyadiewithanarraypatternofbumpsorsolderballsattachedatanI/Opitchthatiscompatiblewithtraditionalcircuitboardassemblyprocesses.WLCSPisessentiallyatruechip-scalepackaging(CSP)technology. WLCSPtechnologydiffersfromotherball-gridarray(BGA)andlaminate-basedCSPsinthatnobondwiresorinterposerconnectionsarerequired.ThekeyadvantagesoftheWLCSPisthedietoPCBinductanceisminimized,reducedpackagesize,andenhancedthermalconductioncharacteristics. WLCSPTurnkeyServiceFlow WLCSPConstruction RefertothefigurebelowforarepresentationofatypicalWLCSPpackagewithRedistributionLayer(RDL)andUnderBumpMetallization(UBM)process.AWLCSPdiehasafirstlayeroforganicdielectric(Polyimide1),ametalredistributionlayer(RDL)tore-routethesignalpathfromthedieperipheralI/Otoanewdesiredlocation,andasecondpolyimidelayer(Polyimide2)tocovertheRDLmetal,whichinturnispatternedintothesolderballarray.Topreventdiffusionandenablesolderwetting,anunder-bumpmetallization(UBM)layerisdepositedontheRDL.Thesolderballisalead-freealloy.Backsidewaferlamination,aprotectivepolymerfilm,isoptionalforWLCSPproductions.Thispolymermaterialoffersbothmechanicalcontact(i.e.SMTassemblypickandplace)andUVlightprotectiontothebacksideofthediesurface.
延伸文章資訊
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