英特爾第10代筆記本處理器仍用14nm工藝 台積電將電晶體做到0.1nm

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作者：NicolasLeeFreud

簡體中文版：

近期英特爾更新了第十代移動（筆記本）處理器，但仍然使用14nm工藝技術。

英特爾對便攜 PC 處理器的疊代仍在進行，近日，英特爾更新了第二批面向輕薄本和二合一設備的第 10 代 Comet Lake 移動處理器。

但不少用戶對於英特爾的這次更新表示困惑。

因為在半個月前，英特爾才剛剛發布了一款基於 10nm 工藝的 Ice Lake 架構處理器，而本次的 Comet Lake 架構處理器雖然同等定位於第 10 代，但卻重新用回過氣的 14nm 工藝。

我覺得最重要的問題根源在於英特爾自身的產能不足，今年 4 月，英特爾官方對外表示，自身處理器存在一定的產能不足、供貨緊張等問題，這種情況可能要到本年第三季度以後才能徹底解決。

所以在短期內，英特爾的 10nm 移動處理器只會專注於高端產品；而對於大量中低端筆記本產品來說，英特爾只能繼續選擇「打磨」相對成熟的 14nm 工藝來滿足現有生產商的需求。

Comet Lake 處理器的參數規則還是一些細節上的變化，此前 Ice Lake 系列處理器僅為 4 核心和 8 線程設計，最高頻率高達 4.1 GHz。

而最新的 Comet Lake 則進一步提升至 6 核心和 12 線程，頻率則最高可達到 4.9GHz，功耗則繼續維持在 7W/15W 。

不過在圖形處理器能力方面則讓人非常失望，和 Ice Lake 採用的全新 Iris Plus 圖形晶片不同，Comet Lake 系列仍然使用傳統的 UHD 晶片模組。

不過比較值得大家關注的是 i7-10710U，這也是英特爾第一顆採用了 6 核心設計的 U 系列處理器，整體性能比上一代提升了 16%，Office 365 辦公應用則會有 41% 的性能提升。

作者點評：英特爾還是同樣的萬年擠牙膏。

台積電研發負責人、技術研究副總經理黃漢森表示台積電未來將電晶體做到0.1nm。

「母庸質疑，摩爾定律依然有效且狀況良好，它沒有死掉、沒有減緩、也沒有帶病。

」台積電研發負責人、技術研究副總經理黃漢森（Philip Wong）在本周開幕的第 31 屆 HotChips 大會專題演講中發表以上演說。

現場的幻燈片中，台積電甚至前瞻到了 2050 年，電晶體來到氫原子尺度，即 0.1nm。

關於未來的技術路線，黃漢森認為像碳納米管（1.2nm 尺度）、二維層狀材料等可以將電晶體變得更快、更迷你；同時，相變內存（PRAM）、旋轉力矩轉移隨機存取內存（STT-RAM）等會直接和處理器封裝在一起，縮小體積，加快數據傳輸速度；此外還有 3D 堆疊封裝技術。

黃漢森強調，社會對先進技術的需求是永無止境的，他亦表示，除了硬體，軟體算法也需要迎頭趕上。

作者點評：50年後，我的子女從褲袋拿出一張類似卡片大小的盒子，跟我說：「爸，這是我們現在用的電腦」。

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English version :

Intel recently updated its tenth-generation mobile (notebook) processor, but still uses 14 nm technology.

Intel's iteration of the portable PC processor is still ongoing, and Intel recently updated the second batch of 10th-generation Comet Lake mobile processors for thin and light books and two-in-one devices. However, many users are confused about this update of Intel. Because half a month ago, Intel just released a 10 nm process-based Ice Lake framework processor, and this time the Comet Lake framework processor is equally positioned in the 10th generation. But it reuses the 14 nm process of returning gas.

I think the most important problem is the root cause of Intel's own lack of production capacity. In April this year, Intel officials said that there are certain problems such as insufficient production capacity and tight supply of its own processors. This situation may not be completely solved until after the third quarter of this year. So in the short term, Intel's 10 nm mobile processor will only focus on high-end products; for a large number of low-end and mid-range notebook products, Intel can only continue to choose to "polish" the relatively mature 14 nm process to meet the needs of existing manufacturers.

The parameter rules for the Comet Lake processor are still changing in detail, after the Ice Lake family of processors was designed for only 4 cores and 8 threads at a maximum frequency of 4.1 GHz. The latest Comet Lake is further upgraded to 6 cores and 12 threads, with a frequency up to 4.9GHz and power consumption maintained at 7 W / 15 W.

But it is disappointing in terms of graphics processor capabilities, and unlike the new Iris Plus graphics chip used by Ice Lake, the Comet Lake series still uses traditional UHD chip modules. However, it is worth noting that the i 7-10710U, which is the first Intel series processor with a 6-core design in Intel, has improved overall performance by 16 over the previous generation, while the Office 365 office application will have a 41 performance improvement.

Author's comment: Intel is still the same ten thousand years of toothpaste squeeze.

Philip Wong, vice president of technology research at Taiwan Semiconductor Manufacturing R&D and head of Taiwan Semiconductor Manufacturing R&D, says Taiwan Semiconductor Manufacturing will make transistors 0.1nm in the future.

"The mother questioned that Moore's Law is still valid and in good condition. It has not died, has not slowed down, and has not been sick. 」 Philip Wong, head of Taiwan Semiconductor Manufacturing R&D and associate President of technology research, spoke at the 31st HotChips conference, which opened this week. In the live slide, Taiwan Semiconductor Manufacturing even looks ahead to 2050, when transistors come to the hydrogen atomic scale, or 0.1nm.

With regard to future technology routes, Mr. Wong believes that transistors, such as carbon nanotubes (1.2nm scale) and two-dimensional layered materials, can be made faster and smaller, while phase change memory (PRAM) and rotary torque transfer random access memory (STT-RAM) are packaged directly with the processor. Reduce size and speed up data transmission; there is also 3 D stack packaging technology.

Philip Wong emphasized that the demand for advanced technology in society is endless. He also said that in addition to hardware, software algorithms also need to catch up.

Author's comment: 50 years later, my children took a card-sized box out of their trouser pocket and said to me, "dad, this is the computer we use now.".

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