ACM Research Strengthens Wet Processing Portfolio with New

(ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, ... ACMResearchStrengthensWetProcessingPortfoliowithNewCompoundSemiconductorTools Productsaddressgrowingdemandfromelectricvehicle,5GcommunicationandAImarkets January25,202216:05ET |Source: ACMResearch,Inc. ACMResearch,Inc. Fremont,California,UNITEDSTATES FREMONT,Calif.,Jan.25,2022(GLOBENEWSWIRE)--ACMResearch,Inc.(ACM)(NASDAQ:ACMR),aleadingsupplierofwaferprocessingsolutionsforsemiconductorandadvancedwafer-levelpackaging(WLP)applications,todayintroduceditscomprehensivetoolsettosupportcompoundsemiconductormanufacturing.ACM’s150mm-200mmbridgesystemssupportfront-endcleaningandawiderangeofWLPapplicationsforcompoundsemiconductorsincludinggalliumarsenide(GaAs),galliumnitride(GaN)andsiliconcarbide(SiC)processes.Thewetprocessportfolioincludescoater,developer,photoresist(PR)stripper,wetetcher,cleanerandmetalplatingtoolsthatfeatureautomatedsystemsforflatornotchedwafers.“Thecompoundsemiconductorindustryisgrowingrapidly,withdemandincreasingacrossavarietyofendmarkets,”saidDr.DavidWang,PresidentandChiefExecutiveOfficerofACM.“ACMhasleverageditsexpertiseandtechnologyinfront-endandWLPtoolsetstodeliverhigh-performanceandcost-effectivesystemstoaddressthespecifictechnologyrequirementsofcompoundsemiconductors.WebelievethemarketforcompoundsemiconductorcapitalequipmentofferssignificantgrowthopportunitiestoACM,asGaAs,GaNandSiCdevicesarebecominganincreasinglyintegralpartoffutureelectricvehicle,5Gcommunicationsystemandartificialintelligencesolutions.”ACM’sCompoundSemiconductorCapitalEquipmentPortfolio:UltraCSiCcleaningtool:ACM’sUltraCSiCcleaningtooltargetsSiCwafercleaningusingsulfuricperoxidemix(SPM)forsurfaceoxidationandhydrofluoric(HF)acidtoremoveresidues.ItalsofeaturesACM’sSAPSandSmartMegasonixtechnologiestoachieveamorecomprehensivecleanwithoutdamagetodevicefeatures.TheUltraCSiCcleaningtooldeliversadvancedcleaningperformancewithlessthan10@0.3umparticlesperwaferandmetallessthan1e10atomspercm3.Thetooldeliversathroughputofmorethan70wafersperhourandisexpectedtobeavailableinthesecondhalfof2022.UltraCwetetchtool:TheUltraCwetetchtooldeliversuniformityoflessthan2%forGaAsandindiumgalliumphosphide(InGaP)processeswithrepeatabilityoflessthan2%.TheUltraCwetetchtooloffershighperformancechemicaltemperaturecontrolandetchinguniformity.ThefirstUltraCwetetchtoolwasdeliveredtoakeycustomerinthethirdquarterof2021andhassincepassedinitialcustomertesting.UltraECPGIII1309tool:ACM’sUltraECPGIII1309toolsupportsCupillarandsolderforCu,nickel(Ni)andtinsilver(SnAg),aswellasredistributionlayer(RDL)andunder-bumpmetallization(UBM)processeswithintegratedpre-wetandpost-cleanchambers.Itachieveswithin-waferandwithin-dieuniformityoflessthan3%andrepeatabilityoflessthan2%.ThefirstUltraECPGIII1309toolwasdeliveredtoakeycustomermid-2021andsuccessfullypassedcustomertesting.UltraECPGIII1108tool:TheUltraECPGIII1108toolprovidesAubumping,thinfilmanddeepviaprocesseswithintegratedpre-wetandpost-cleanchambers.ItusesACM’sprovenpaddletechnologyfordeepviaplatingtoimprovestepcoverage.Itdeliverswithin-waferandwithin-dieuniformityoflessthan3%andrepeatabilityoflessthan2%.ThechamberandtankarespeciallydesignedtoavoidoxidationoftheAuelectrolyte,andthetankfeaturesanitrogengas(N2)purgefunctiontoreduceoxidation.ThefirstUltraECPGIII1108toolwasdeliveredtoakeycustomerinlate2021andsuccessfullypassedcustomertesting.UltraCctcoatingsystemtool:ACM’sUltraCctcoatingsystemenablesevencoatingofPRchemistryusingdouble-coat,spin-coatingtechnology.Itoffersadvancedbenefits,includingprecisecoatingcontrol,auto-cleanfunctionalities,hotandcoldplatemodules,andindependentprocesscontrolfunctionsforeachchamber.UltraCdvdevelopertool:ACM’sUltraCdvdevelopertoolperformsthecrucialstepsofpostexposurebaking,developingandhardbakeforcompoundsemiconductorprocesses.ItleveragesACM’ssuperiortechnologytoachieve+/-0.03LPMofthedesiredflowrateand+/-0.5Celsiusofthedesiredtemperature.UltraCsscrubbersystem:TheUltraCsscrubbersystemleveragesACM’sstate-of-the-artwetcleaningtechnologyforsuperiorcontaminantremoval.ItachieveshighperformancethroughN2sprayorhighpressuretorealizemoreeffectivecleaningforsmallerparticles.ItisalsofullycompatiblewithACM’sproprietarySmartMegasonixtechnologytoensureexcellentparticleremovalefficiency(PRE)withoutdamagingfinerpatternstructures.UltraCprwetstrippingsystem:ACM’sUltraCprwetstrippingsystemsutilizebothwetbenchtanksoakingandsingle-waferprocessingtoensuremaximumeffectivenessforcompoundsemiconductorstripping.Thetoolwasrecentlyorderedbyaleadingglobalintegrateddevicemanufacturer(IDM)foreaseofuseinPRremoval,furthervalidatingACM’stechnology.UltraSFPpolishingsystem:TheUltraSFPprovidesanenvironmentallyfriendlyalternativetoconventionalchemicalmechanicalplanarizationthrough-siliconvia(TSV)processesandfan-outwafer-levelpackaging(FOWLP).InTSVapplications,ACM’sstress-freepolishing(SFP)systemisusedtoremovebulkcopperoverburdendownto0.2µmbyemployingproprietaryelectro-polishingtechnology,furtherremovecoppertobarrierlayerbyemployingconventionalCMP,andtoremovebarrierbyemployingwetetch,whichsignificantlyreducescostofconsumable.ForFOWLP,thesameprocesscanhandlewaferwarpagecausedbystressofthickcopperlayer,removescopperoverburdenandplanarizesRDLs.AboutACMResearch,Inc.ACMdevelops,manufacturesandsellssemiconductorprocessequipmentforsingle-waferorbatchwetcleaning,electroplating,stress-freepolishingandthermalprocesses,whicharecriticaltoadvancedsemiconductordevicemanufacturingandwafer-levelpackaging.Thecompanyiscommittedtodeliveringcustomized,high-performance,cost-effectiveprocesssolutionsthatsemiconductormanufacturerscanuseinnumerousmanufacturingstepstoimproveproductivityandproductyield.Formoreinformation,visitwww.acmrcsh.com.ForwardLookingStatementInformationpresentedinthispressreleaseincludesforward-lookingstatementsforpurposesofthesafeharborprovisionsofthePrivateSecuritiesLitigationReformActof1995.Allstatementscontainedinthispressreleasethatdonotrelatetomattersofhistoricalfactshouldbeconsideredforward-lookingstatements,includingstatementsinthesecondparagraphwithrespecttotheprojectedmarketopportunitiesandstatementsinthethirdparagraphwithrespecttoprojectedtimingoftheavailabilityofACM’sUltraCcleaningtool.Forward-lookingstatementsarebasedonACMmanagement’scurrentexpectationsandbeliefs,andinvolveanumberofrisksanduncertaintiesthataredifficulttopredictandthatcouldcauseactualresultstodiffermateriallyfromthosestatedorimpliedbytheforward-lookingstatements.Thoserisksanduncertaintiesinclude,butarenotlimitedto,thefollowing,anyofwhichcouldbeexacerbatedevenfurtherbythecontinuingCOVID-19outbreakinChinaandglobally:anticipatedcustomerordersoridentifiedmarketopportunitiesmaynotgrowordevelopasanticipated;customerordersalreadyreceivedmaybepostponedorcanceled;ACMmaybeunabletoobtainthequalificationandacceptanceofitsdeliveredtoolswhenanticipatedoratall,whichwoulddelayorprecludeACM’srecognitionofrevenuefromthesaleofthosetools;suppliersmaynotbeabletomeetACM’sdemandsonatimelybasis;ACM’stechnologiesandtoolsmaynotgainmarketacceptance;ACMmaybeunabletocompeteeffectivelyby,amongotherthings,enhancingitsexistingtools,addingadditionalproductioncapacityandengagingadditionalmajorcustomers;volatileglobaleconomic,market,industryandotherconditionscouldresultinsharplylowerdemandforproductscontainingsemiconductorsandforACM'sproductsandindisruptionofcapitalandcreditmarkets;ACM’sfailuretosuccessfullymanageitsoperations,includingitsinabilitytohire,train,integrateandmanageadditionalqualifiedengineersforresearchanddevelopmentactivities;andtraderegulations,currencyfluctuations,politicalinstabilityandwarmaymateriallyadverselyaffectACMduetoitssubstantialnon-U.S.customerandsupplierbaseanditssubstantialnon-U.S.manufacturingoperations.Afurtherdescriptionoftheserisks,uncertaintiesandothermatterscanbefoundinfilingsACMmakeswiththeSecuritiesandExchangeCommission.Becauseforward-lookingstatementsinvolverisksanduncertainties,actualresultsandeventsmaydiffermateriallyfromresultsandeventscurrentlyexpectedbyACM.ACMundertakesnoobligationtopubliclyupdatetheseforward-lookingstatementstoreflecteventsorcircumstancesthatoccurafterthedatehereofortoreflectanychangeinitsexpectationswithregardtotheseforward-lookingstatementsortheoccurrenceofunanticipatedevents.©ACMResearch,Inc.SAPS,SmartMegasonix,UltraCandtheACMResearchlogoaretrademarksofACMResearch,Inc.Forconvenience,thesetrademarksappearinthispressreleasewithout™symbols,butthatpracticedoesnotmeanthatACMwillnotassert,tothefullestextentunderapplicablelaw,itsrightstosuchtrademarks. MediaContact: CompanyContacts: JillianCarapella   USAKiterocket RobertMetter+1646.402.2408  ACMResearch,[email protected]   +1503.367.9753   China XiWang ACMResearch(Shanghai),Inc. +862150808868   Korea YYKim ACMResearch(Korea),Inc. +821041415171   Taiwan DavidChang +886921999884   Singapore AdrianOng +658813-1107