advanced wafer cleaning wet processing technologies - ACM ...
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Founded in 1998 in Silicon Valley, ACM Research, Inc. develops wet processing technology and products for the semiconductor and wafer level packaging (WLP) ... Searchfor: MenuICManufacturingSAPSTechnologyCleaningTEBOTechnologyCleaningTahoeCleaningSystemsBacksideCleaningSystemsWetBenchCleaningSystemsScrubberSystemsDualDamasceneElectroplatingSystemsTSVElectroplatingSystemsFurnaceSystemsCloseCompoundSemiconductorsPlatingSystemsCloseWaferLevelPackagingCoatingSystemsDeveloperSystemsWetStrippingSystemsWetEtchingSystemsScrubberSystemsElectroplatingSystemsStressFreePolishingSystemsCloseTechPapersCompanyCareersBlogsandArticlesSeniorManagementBoardMembersPrivacyPolicyCloseInvestorsContact InsideSlider ACMResearch Dedicatedtoadvancedsemiconductorwetprocessing Focusedoninnovativewafercleaning Foundedin1998inSiliconValley,ACMResearch,Inc.developswetprocessingtechnologyandproductsforthesemiconductorandwaferlevelpackaging(WLP)industries.ThecompanyhasproducedequipmentforarangeofapplicationsinICmanufacturingandWLP—withaspecialfocusoncleaningtechnologiesforadvancedsemiconductordevices. InSeptember2006,ACMexpandeditsoperationsintoAsiaandformedthesubsidiary,ACMResearch(Shanghai),Inc.ACMnowhascompleteR&D,engineeringandmanufacturingoperationsatitsZhangjiangHigh-TechParkfacilityinShanghai,China.InJune2011,thecompanyformedasecondsubsidiary,ACMResearch(Wuxi),Inc.,tobetterservetocustomersinthatregion.Inaddition,advancedservicecoveragehasalsobeenpositionedatstrategiclocationsaroundtheglobe,includingBeijing,Taiwan,Korea,andtheU.S.,toprovideworld-classsupportforcustomersworldwide. Thecompany’sinitialfocuswasonultra-low-Kdielectricandcopperintegration,particularlyonstress-freecopperpolishingtechnology,withthefirstproductbeingintroducedin2001andsoldtoleading-edgewafermanufacturersintheU.S.In2003thecompanybegantodesigninnovativenewsinglewafercleaningequipmentaimedattheemerginggenerationsofICchipsthatpresentedincreasingchallengesfordefectreduction.ACMResearchhasestablishedimportantintellectualproperty(IP)initsproprietarySpaceAlternatedPhaseShift(SAPS™)andTimelyEnergizedBubbleOscillation(TEBO™)megasoniccleaningtechnologies,alongwiththeirspecialchamberandplatformdesigns.TheTEBOtechnologyinparticularhasbeengroundbreakingandrevolutionaryinenablingfuturegenerationsofsemiconductorcircuits. InOctober2008,ACMResearchShanghaiwonanR&Dgranttodevelopandcommercializethe65-45nmstress-freeCupolishingtechnology(SFP™).InJanuary2014thecompanywonanotherR&DgranttodevelopACM’snewelectro-copperplating(ECP™)technology.PresentlyholdingastrongIPportfolioofover140internationallygrantedpatents,ACMiscommittedtoprovidingcustomerswithleading-edgetechnology,world-classproductsandunrivaledserviceandsupport.
延伸文章資訊
- 1ACM Research Strengthens Wet Processing Portfolio with New
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Founded in 1998 in Silicon Valley, ACM Research, Inc. develops wet processing technology and prod...
