Oxygen Plasma

Oxygen plasma refers to any plasma treatment performed while introducing oxygen to the plasma chamber. Oxygen is often used to clean surfaces prior to bonding. Followuson: Systems ViewAllSystems EntryLevelSystems PE-25 PE-50 PE-50XL PE-75 PE-25Venus PE-50Venus PE-50XLVenus PE-75Venus BenchtopSystems PE-100 PE-200 HighVolumeSystems BT-1 BT-Tumbler TT-1 PE-2000R PE-5000 ProductionPCBEtchingSystems MK-II MK-IIVertical MK-IIECO Magna AtmosphericSystems PlasmaWand AtmosphericSystem HandHeldAtmosphericSystem PolymerizationSystems PE-100PolymerizationSystem PE-200PolymerizationSystem BT-1PolymerizationSystem CustomSystems UsedSystems Services ContractServices SampleProcessing PumpRebuildingServices Learn PlasmaTreatments PlasmaTreatment VacuumPlasma PlasmaBonding DryEtching OxygenPlasma ArgonPlasma PCBEtchingMachines PlasmaActivation PlasmaFunctionalization PlasmaCleaning PlasmaEtching PlasmaPolymerization PlasmaSurfaceModification ReactiveIonEtching PlasmaEquipment PlasmaApplications Parts AboutUs CompanyInformation WhyPlasmaEtch InnovationsandMilestones Employment TradeShows/Blog Contact HomeLearnPlasmaTreatmentsOxygenPlasmaTreatment WhatisOxygenPlasma? Oxygenplasmareferstoanyplasmatreatmentperformedwhileintroducingoxygentotheplasmachamber.Oxygenisoftenusedtocleansurfacespriortobonding.Itmayalsobecombinedwithothergasestoetchavarietyofmaterialssuchasplasticandrubber. OxygenplasmainaPE-50plasmacleaner. Oxygen(O2)isthemostcommongasusedinplasmacleaningtechnologyduetoitslowcostandwideavailability.Oxygenplasmaiscreatedbyutilizinganoxygensourceonaplasmasystem. AllsystemsavailablefromPlasmaEtchwillworkwithoxygengas.Anoxygengeneratorcanbepurchasedandsetuprightinyourlab. Oxygengasiscommonlyusedtocleannon-metalmaterialssuchasglass,plastics,andTeflon.Likeotherformsofplasma,oxygencleansorganicsandiscapableofsurfacemodification. O2plasmawillcleanthesurfaceofaplasticsampleandincreaseitswettability.Oxygenplasmacanalsobeusedtocleanmetalsurfacesifit'smixedwithArgon.Argongasstripstheoxygenmoleculeawayfromthemetaltopreventoxidation. PlasmaAshingwithOxygen Plasmaashingistheprocessofremovingcarbonfromproductsduringthemanufacturingprocess.Plasmaashingisalwaysperformedwithoxygenplasmainahighfrequencyplasmasystem. Generally,thegoalofplasmaashingistocompletelyremoveorganicmatter,includingvolatilecarbonoxidesandwatervapor.Allremovedcontaminantsarepumpedoutofthechamberbythevacuumsystem. Oxygenplasmaremovesalltracesoforganicmatterandleavesnoresiduesunlesstherewereexcessiveinorganiccontaminantsonthesample. OxygenPlasmawithArgon Anothergascommonlyusedforplasmatreatmentisargon.Themostnotabledifferencebetweenoxygenandargonisthatoxygenplasmaiscapableofsurfacemodification,whileargonisnot.Additionally,oxygenwilletchwhileargonwillonlyclean. Ifleftintheplasmafortoolong,oxygenmaymodifythesurfaceofsomeplasticsrenderingthemunbondable;however,argonissafetouseforlongerperiodsoftime. Oxygenplasmaneedsanadditionaloxidationpreventinggasformaterialsthatoxidizeeasily(e.g.silver,copper);argonistypicallyusedwithoxygen. OxygenandCF4 O2mayalsobemixedwithCF4forreactiveionetchingapplicationsinlargerplasmasystems.PlasmaEtchcurrentlyoffersthreesystemscapableofreactiveionetching:PE-100,PE-200,andBT-1. Next:ArgonPlasma LearnAboutPlasma PlasmaTreatmentLearnaboutplasma-howit'sused,andwhousesit. PlasmaCleaningCleaningremovesallorganiccontamination.Learnwhichgasesareusedforthecleaningprocess. VacuumPlasmaAllofoursystemsarebuiltaroundthelonglastingeffectsofvacuumplasma. PlasmaBondingCreatethestrongestbondpossiblebetweentwodissimilarmaterials. PlasmaActivationActivateasurfacewithplasmaforbetterprintingorbonding. PlasmaFunctionalizationFunctionalizationimprovesadhesivepropertiessuchasbondabilityandpaintability. PlasmaEtchingEtchawaymaterialforintegratedcircuits,rubbers,dielectrics,plastics,andmore. DryEtchingModifysurfaceswiththemostreliableandenvironmentallyfriendlytechnologyavailable. PlasmaDescumClean(degunk)wirebondholesafterdrillingthroughaPCBboard. PCBEtchingMachinesPlasmaetchingisperformedonprintedcircuitboards. ReactiveIonEtchingAnaggressive,directionaletchusefulformanufacturingmicrosemiconductors. PlasmaPolymerizationLearnhowtopreventsiliconproductsfromstickingtogetherwithsurfacemodification. PlasmaSurfaceModificationLearnhowprintingandbondingcanbeimprovedonnearlyanymaterial. OxygenPlasmaOxygenplasmaisthemostcommongasusedforcleaningandplasmasurfacemodification. PlasmaEquipmentLearnabouttheequipmentneededtoperformplasmacleaningandetching. ArgonPlasmaArgonplasmaiscommonlyusedtopreventoxidationofmetal. PlasmaApplicationsSeerealworldexamplesofplasmaapplicationsusingPlasmaEtchequipment. RecommendedSystems PE-25PlasmaCleanerThePE-25isanaffordableyetfullyautomatedentryleveloptionforplasmacleaning. PE-100PlasmaSystemThePE-100isourmostpopularplasmasystem. PlasmaEtch,Inc.hasbeenaleader,innovator,andproducerofplasmatechnologysince1980.We'vedevelopedawiderangeofsolutionsforplasmacleaning,plasmaetching,reactiveionetching(RIE),plasmatreatment,surfacemodification,andotherfacetsofplasmaprocessing.Ourcompany,headquarteredinCarsonCity,NVinacustom-builtfactory,isfocusedondesigningandproducingcuttingedgetechnologyandplasmaequipmentforeveryindustryandapplication.Fromscientificresearchtomanufacturingandeverythinginbetween,wehaveanidealsolution. ©2020PlasmaEtch,Inc 3522ArrowheadDriveCarsonCity,NV89706 [email protected]|775-883-1336 PlasmaInformation PlasmaTreatment VacuumPlasma ReactiveIonEtching PlasmaBonding DryEtching OxygenPlasma ArgonPlasma PCBEtchingMachines PlasmaActivation PlasmaFunctionalization PlasmaCleaning PlasmaEtching PlasmaPolymerization PlasmaSurfaceModification PlasmaSurfaceTreatments PlasmaEquipment Industries Ceramics Manufacturing Medical MEMS Plastics PrintedCircuitBoards Rubbers Science/Academia Semiconductor Systems PlasmaWand PE-25 PE-50 PE-50XL PE-75 PE-25Venus PE-50Venus PE-50XLVenus PE-75Venus PE-100 PE-200 AtmosphericPlasmaSystem BT-1 BT-Tumbler TT-1 MK-II MK-IIECO MK-IIVertical PE-2000R