Plasma cleaning - Wikipedia

A second cleaning action is carried out by the oxygen species created in the plasma (O2+, O2−, O3, O, O+, O−, ionised ozone, metastable excited oxygen, and ... Plasmacleaning FromWikipedia,thefreeencyclopedia Jumptonavigation Jumptosearch Fig.1.ThesurfaceofaMEMSdeviceiscleanedwithbright,blueoxygenplasmainaplasmaetchertoriditofcarboncontaminants.(100mTorr,50WRF) Plasmacleaningistheremovalofimpuritiesandcontaminantsfromsurfacesthroughtheuseofanenergeticplasmaordielectricbarrierdischarge(DBD)plasmacreatedfromgaseousspecies.Gasessuchasargonandoxygen,aswellasmixturessuchasairandhydrogen/nitrogenareused.Theplasmaiscreatedbyusinghighfrequencyvoltages(typicallykHzto>MHz)toionisethelowpressuregas(typicallyaround1/1000atmosphericpressure),althoughatmosphericpressureplasmasarenowalsocommon.[1] Contents 1Methods 2Applications 2.1Cleaning&Sterilization 2.2LifeSciences 2.3MaterialsScience 2.4Microfluidics 2.5SolarCells&Photovoltaics 3References Methods[edit] Inplasma,gasatomsareexcitedtohigherenergystatesandalsoionized.Astheatomsandmolecules'relax'totheirnormal,lowerenergystatestheyreleaseaphotonoflight,thisresultsinthecharacteristic“glow”orlightassociatedwithplasma.Differentgasesgivedifferentcolors.Forexample,oxygenplasmaemitsalightbluecolor. Aplasma’sactivatedspeciesincludeatoms,molecules,ions,electrons,freeradicals,metastables,andphotonsintheshortwaveultraviolet(vacuumUV,orVUVforshort)range.Thismixturetheninteractswithanysurfaceplacedintheplasma. Ifthegasusedisoxygen,theplasmaisaneffective,economical,environmentallysafemethodforcriticalcleaning.TheVUVenergyisveryeffectiveinthebreakingofmostorganicbonds(i.e.,C–H,C–C,C=C,C–O,andC–N)ofsurfacecontaminants.Thishelpstobreakaparthighmolecularweightcontaminants.Asecondcleaningactioniscarriedoutbytheoxygenspeciescreatedintheplasma(O2+,O2−,O3,O,O+,O−,ionisedozone,metastableexcitedoxygen,andfreeelectrons).[2]ThesespeciesreactwithorganiccontaminantstoformH2O,CO,CO2,andlowermolecularweighthydrocarbons.Thesecompoundshaverelativelyhighvaporpressuresandareevacuatedfromthechamberduringprocessing.Theresultingsurfaceisultra-clean.InFig.2,arelativecontentofcarbonovermaterialdepthisshownbeforeandaftercleaningwithexcitedoxygen[1]. Fig.2.Contentofcarbonovermaterialdepthz:beforeasampletreatment-diamondpointsandafterthetreatmentduring1s.-squarepoints Ifthepartconsistsofeasilyoxidizedmaterialssuchassilverorcopper,thetreatmentusesinertgasessuchasargonorheliuminstead.Plasmaactivatedatomsandionsbehavelikeamolecularsandblastandcanbreakdownorganiccontaminants.Thesecontaminantsvaporizeduringprocessingandareevacuatedfromthechamber. Mostoftheseby-productsaresmallquantitiesofgases,suchascarbondioxideandwatervaporwithtraceamountsofcarbonmonoxideandotherhydrocarbons. Whetherornotorganicremovaliscompletecanbeassessedwithcontactanglemeasurements.Whenanorganiccontaminantispresent,thecontactangleofwaterwiththedeviceishigh.Contaminantremovalreducesthecontactangletothatcharacteristicofcontactwiththepuresubstrate.Inaddition,XPSandAFMareoftenusedtovalidatesurfacecleaningandsterilizationapplications.[3] Ifasurfacetobetreatediscoatedwithapatternedconductivelayer(metal,ITO),treatmentbydirectcontactwithplasma(capableforcontractiontomicroarcs)couldbedestructive.Inthiscase,cleaningbyneutralatomsexcitedinplasmatometastablestatecanbeapplied.[4]ResultsofthesameapplicationstosurfacesofglasssamplescoatedwithCrandITOlayersareshowninFig.3. Fig.3.ContactAngleofWaterDropletof5μlonglasscoatedwithdifferentmaterials. Aftertreatment,thecontactangleofawaterdropletisdecreasedbecominglessthanitsvalueontheuntreatedsurface.InFig.4,therelaxationcurvefordropletfootprintisshownforglasssample.AphotographofthesamedropletontheuntreatedsurfaceisshowninFig.4inset.SurfacerelaxationtimecorrespondingtoadatashowninFig.4isabout4hours. Plasmaashingisaprocessthatusesplasmacleaningsolelytoremovecarbon.PlasmaashingisalwaysdonewithO2gas.[5] Fig.4.Surfaceareaofwaterdropletof5μlvolumefootprintonglasssurfaceversustimetafteritstreatment.Dropletonuntreatedglassisshownininset. Applications[edit] Fig.5.Plasmabeamcleaningametalsurface Plasmacleaningisoftenrequiredfortheremovalofcontaminantsfromsurfacesbeforetheycanbeusedinamanufacturingprocess.Plasmacleaningcanbeappliedtoanarrayofmaterialsalongwithsurfaceswithcomplexgeometries.Plasmacleaninghasthecapabilitiestoeffectivelyremoveallorganiccontaminationfromsurfacesthroughtheprocessofachemicalreaction(airplasma)orphysicalablation(Arplasma/Argonplasma).AphotographofaplasmabeamonanuntreatedmetalsurfaceisshowninFig.5inset.[6] Cleaning&Sterilization[edit] Plasmacleaningremovesorganicscontaminationthroughchemicalreactionorphysicalablationofhydrocarbonsontreatedsurfaces.[3]Chemicallyreactiveprocessgases(air,oxygen)reactwithhydrocarbonmonolayerstoformgaseousproductsthataresweptawaybythecontinuousgasflowintheplasmacleanerchamber.[7]Plasmacleaningcanbeusedinplaceofwetchemicalprocesses,suchaspiranhaetching,whichcontaindangerouschemicals,increasedangerofreagentcontaminationandrisketchingtreatedsurfaces.[7] RemovalofSelfAssembledMonolayersofalkanethiolatesfromgoldsurfaces[7] Residualproteinsonbiomedicaldevices[3] NanoelectrodeCleaning[8] LifeSciences[edit] Cellviability,function,proliferationanddifferentiationaredeterminedbyadhesiontotheirmicroenvironment.[9]Plasmaisoftenusedasachemicalfreemeansofaddingbiologicallyrelevantfunctionalgroups(carbonyl,carboxyl,hydroxyl,amine,etc)tomaterialsurfaces.[10]Asaresult,plasmacleaningimprovesmaterialbiocompatibilityorbioactivityandremovescontaminatingproteinsandmicrobes.Plasmacleanersareageneraltoolinthelifesciences,beingusedtoactivatesurfacesforcellculture,[11]tissueengineering,[12]implantsandmore. TissueEngineeringSubstrates[12] Polyethyleneterephthalate(PET)celladhesion[11] ImprovedBiocompatibilityofImplants:vasculargrafts,[13]StainlessSteelScrews[14] Longtermcellconfinementstudies[15] PlasmaLithographyforPatterningCellCultureSubstrates[16] Cellsortingbystrengthofadhesion[17] Antibioticremovalbyplasmaactivatedsteelshavings[18] SingleCellSequencing[19] MaterialsScience[edit] Surfacewettingandmodificationisafundamentaltoolinmaterialsscienceforenhancingmaterialcharacteristicswithoutaffectingbulkproperties.PlasmaCleaningisusedtoaltermaterialsurfacechemistriesthroughtheintroductionofpolarfunctionalgroups.Increasedsurfacehydrophilicity(wetting)followingplasmatreatmentimprovesadhesionwithaqueouscoatings,adhesives,inksandepoxies: EnhancedThermopowerofGrapheneFilms[20] Workfunctionenhancementinpolymersemiconductorheterostructures[21] ImprovedadhesionofUltra‐highmoduluspolyethylene(Spectra)fibersandaramidfibers[22] PlasmaLithographyfornanoscalesurfacestructuresandquantumdots[23] Micropatterningofthinfilms[24] Microfluidics[edit] Theuniquecharacteristicsofmicroornanoscalefluidflowareharnessedbymicrofluidicdevicesforawidevarietyofresearchapplications.Themostwidelyusedmaterialformicrofluidicdeviceprototypingispolydimethylsiloxane(PDMS),foritsrapiddevelopmentandadjustablematerialproperties.PlasmacleaningisusedtopermanentlybondPDMSMicrofluidicchipswithglassslidesorPDMSslabstocreatewater-tightmicrochannels.[25] Bloodplasmaseparation[26] SingleCellRNASequencing[19] ElectroosmoticFlowValves[27] WettabilityPatterninginMicrofluidicDevices[28] LongTermRetentionofMicrofluidicDeviceHydrophilicity[29] SolarCells&Photovoltaics[edit] Plasmahasbeenusedtoenhancetheperformanceofsolarcellsandenergyconversionwithinphotovoltaicdevices: ReductionofMolybdenumOxide(MoO3)enhancesshortcircuitcurrentdensity[30] ModifyTiO2Nanosheetstoimprovehydrogengeneration[31] EnhancedconductivityofPEDOT:PSSforbetterefficiencyinITO-freeperovskitesolarcells[32] References[edit] 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