Wafer level CSP - Raytek Semiconductor,Inc. | One stop turn ...

Definition of WLCSP is Package IC, compatible with standard PCB interconnect technology and with a size equal to the ... WLCSP Process Flow- Ball Placement ... PRODUCT&PROCESS WAFERLEVELCHIPSCALEPACKAGE DefinitionofWLCSPisPackageIC,compatiblewithstandardPCBinterconnecttechnologyandwithasizeequaltothechipsize,fabricatedusingwafer-levelprocess.Currentlyonlyplatingtechnologyisapplied. Features Supportvariouswafersize:12-inch(300mm),8-inch(200mm),6-inch(150mm) Structure&Material:ElectroplatingsolderwithSnAg1.8%,SnAu80%;Polyimidecuringat200°C(lowtemp)and375°C(hightemp) BumpHeight:Standardbumpheightbetween68umand167um,andcouldbeadjustedaspercustomerrequirement. Design:CombinewithCuRDLtoserveWaferlevelCSPapplication,andRaytekmayprovidewideUBMsizesuchas240umforthinWLCSPpackage.ThisisveryimportantforlowformfactorWLCSPdemandforportabledevices. TurnkeyService: ProvideWLCSPTurnkeyService,includingBumping,Test,Grinding,Dicing,Tape&Reel. Applications ApplicableProducts:DRAM,NorFlash,FPGA,CommunicationSecurityChip,PowerTransistor,... WLCSPProcessFlow-Plating WLCSPProcessFlow-BallPlacement