WLCSP Wafer Level CSP Wafer Level Packaging - Amkor ...
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Amkor's Wafer Level CSP (WLCSP) provides a solder interconnection directly between ... This simplified process flow reduces cost and cycle time by over 20%. WLCSP Enablehighersemiconductorcontentinahighperforming,smallsizedpackage Home|Packaging|WaferLevelPackaging|WLCSP VIEWRELATEDDOWNLOADS WLCSPDataSheet(DS720) WLCSPDataSheet(DS720) WLCSPDataSheet(DS720) WLCSPDataSheet(DS720) WLFO/WLCSP+DataSheet(DS701) WLFO/WLCSP+DataSheet(DS701) WLFO/WLCSP+DataSheet(DS701) WLFO/WLCSP+DataSheet(DS701) WLSiP&WL3DDataSheet(DS703) WLSiP&WL3DDataSheet(DS703) WLSiP&WL3DDataSheet(DS703) WLSiP&WL3DDataSheet(DS703) WaferBumpingDataSheet WaferBumpingDataSheet WaferBumpingDataSheet WaferBumpingDataSheet AmkorLineCard AmkorLineCard AmkorLineCard AmkorLineCard TestServicesBrochure TestServicesBrochure TestServicesBrochure TestServicesBrochure MeetingindustrydemandsforturnkeyWLCSPproducts AmkorTechnologyoffersWaferLevelChipScalePackaging(WLCSP)providingasolderinterconnectiondirectlybetweenadeviceandthemotherboardoftheendproduct.WLCSPincludeswaferbumping(withorwithoutpadlayerredistributionorRDL),waferlevelfinaltest(probe),devicesingulationandpackingintape&reeltosupportafullturnkeysolution. Amkor’srobustUnderBumpMetallurgy(UBM)overPBOorPIdielectriclayersonthedieactivesurfaceprovidesareliableinterconnectsolutionabletosurviveharshboardlevelconditionsmeetingthedemandsofthegrowingglobalconsumermarketplaceforportableelectronics. TheWLCSPpackagefamilyisapplicableforawiderangeofsemiconductordevicetypesfromhighendRFWLANcombochips,toFPGAs,powermanagement,Flash/EEPROM,integratedpassivenetworks,standardanalogandsomeautomotiveapplications.WLCSPoffersthelowesttotalcostofownershipenablinghighersemiconductorcontentwhileleveragingthesmallestformfactorandoneofthehighestperforming,mostreliable,semiconductorpackageplatformsonthemarkettoday. AmkoroffersthreeWLCSPoptions CSPnlBumponRepassivation(BoR)optionprovidesareliable,cost-effective,truechip-sizepackageondevicesnotrequiringredistribution.TheBoRoptionutilizesarepassivationpolymerlayerwithexcellentelectrical/mechanicalproperties.AUBMisadded,andsolderbumpsareplaceddirectlyoverdieI/Opads.CSPnlisdesignedtoutilizeindustry-standardsurfacemountassemblyandreflowtechniques. CSPnlBumponRedistribution(RDL)optionaddsaplatedcopperRedistributionLayer(RDL)torouteI/OpadstoJEDEC/EIAJstandardpitches,avoidingtheneedtoredesignlegacypartsforCSPapplications.Anickel-basedorthickcopperUBMofferings,alongwithpolyimideorPBOdielectrics,providebestinclassboardlevelreliabilityperformance.CSPnlwithRDLutilizesindustry-standardsurfacemountassemblyandreflowtechniquesanddoesnotrequireunderfillonqualifieddevicesizeandI/Olayouts. CSPn3optionutilizesonelayerofcopperforbothredistributionandUBM.Thissimplifiedprocessflowreducescostandcycletimebyover20%.CSPn3hasbeeninproductionsince2009andhasarunrateofover4billionunitssinceitsintroduction. Questions? ContactanAmkorexpertbyclickingtherequestinfobuttonbelow. RequestInfo
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