Smarter megasonic wafer cleaning from ACM Research

These proprietary new ACM technologies are able to precisely control both the ... to advanced semiconductor device manufacturing and wafer-level packaging. Searchfor: MenuICManufacturingSAPSTechnologyCleaningTEBOTechnologyCleaningTahoeCleaningSystemsBacksideCleaningSystemsWetBenchCleaningSystemsScrubberSystemsDualDamasceneElectroplatingSystemsTSVElectroplatingSystemsFurnaceSystemsCloseCompoundSemiconductorsPlatingSystemsCloseWaferLevelPackagingCoatingSystemsDeveloperSystemsWetStrippingSystemsWetEtchingSystemsScrubberSystemsElectroplatingSystemsStressFreePolishingSystemsCloseTechPapersCompanyCareersBlogsandArticlesSeniorManagementBoardMembersPrivacyPolicyCloseInvestorsContact WaferLevelWafer-levelpackagingsystemsdesignedtomeetcustomerneedsLearnMoreFrontEndCleaningTheindustry’smostadvancedfront-endwafercleaningtechnologiesLearnMore Smarter Megasonic Cleaning ForAdvanced 2Dand3D Devices Thorough Wafer-wide Cleaning Gentler Damage-free Cleaning Reducing Defects,Raising Yields ProprietaryTechnology OurSmartMegasonix™istheindustry’smostadvancedcleaningtechnology,whichachievesthorough,comprehensivecleaningevenlyacrossthewaferandwithoutdamagetodevicefeatures.TheseproprietarynewACMtechnologiesareabletopreciselycontrolboththepowerintensityandthedistributionofmegasoniccleaning—withdramaticallypositiveeffect. « » ACMResearch-RecognizedforExcellence ACMResearch–RecognizedforExcellence SAPS™cleaningtechnology:forflatandpatternedwafers ACM’sproprietarySpaceAlternatedPhaseShift(SAPS™)technologyemploysalternatingphasesofmegasonicwavestodelivermegasonicenergytoflatandpatternedwatersurfacesinhighlyuniformmanneronamicroscopiclevel.Thisenablesittoremoverandomdefectsacrossanentirewafermuchmoreefficientlythanconventionaljet-sprayprocesses. LearnmoreonACM’sSAPScleaningsystems. TEBO™cleaningtechnologyforhigh-aspect-ratio2Dandadvanced3Dpatternedwafers Foradvancedwafercleaningsystems,ACM’sTimelyEnergizedBubbleOscillation(TEBO™)technologyprovidesefficient,damage-freecleaningof2Dpatternedchipsand3DstructuressuchasFinFET,DRAM,3DNAND,and3Dcross-pointmemory,evendeviceswithveryhighaspectratios.Itenablesprecise,multi-parametercontrolofbubblecavitationduringmegasoniccleaning. LearnmoreonACM’sTEBOcleaningsystems. UltraSFPapforadvancedpackagingapplications Builtonourprovenstress-freepolishing(SFP)technology,theUltraSFPapisdesignedtoaddresscommonyieldissuesassociatedwiththrough-siliconvia(TSV)processesandfan-outwafer-levelpackaging(FOWLP).Theseincludecopperoverburdenpost-TSVfillandwaferwarpageissueswithFOWLPprocesses. LearnmoreonACM’sSFPsystems.  Tahoe:High-performance,eco-friendlySPMcleaningtechnology “UltraC”standsfor“ultra-clean”–andwiththeUltraCTahoecleaningsystem,thisrefersbothtotheprocessesthetoolperforms,aswellasitsimpactontheenvironment.TheUltraCTahoesystemtakessulfuricperoxidemix(SPM)cleaningtothenextlevelbyreducingtheamountofsulfuricacidneededfortheprocess,whichinturnlowersbothchemicalandpost-processwastetreatmentcosts. LearnmoreonACM’sTahoecleaningsystems.  UltraECPmapforfront-enddual-damasceneapplications BuildingonourprovenElectrochemicalplating(ECP)technology,theUltraECPmapisconfiguredwithACM’sexclusiveMulti-AnodePartialPlatingfunction,whichallowsthedepositionofthecoppermetallayeronadual-damascenestructure.Ourprocessiscompatiblewith55nm/40nm/28nm/14nmapplicationsandbeyond. LearnmoreonACM’sECPsystems. « » 123456 WhoWeAre Wedevelop,manufacture,andsellsemiconductorprocessequipmentandservicesolutionsforsingle-waferorbatchwetcleaning,electroplating,stress-freepolishing,andthermalprocessescriticaltoadvancedsemiconductordevicemanufacturingandwafer-levelpackaging. Wearecommittedtodeliveringcustomized,high-performance,cost-effectiveprocessandsupportsolutionsthatsemiconductormanufacturerscanuseinnumerousmanufacturingstepstoimproveproductivityandproductyield. OurSolutions ICManufacturingSystems  Wafer-LevelPackagingSystems