Glass Wafer Fabrication | Glass Wafers | Swift Glass

In MEMS applications, glass wafers are often used as a substrate carrier in the fabrication process for thinner silicon wafers. MEMS components such as silicon ... GlassWaferFabrication(Borosilicate&Quartz) AtSwiftGlass,we’vehonedourglassdesignandproductioncapabilitiesformorethan80years.Usingthelatestinnovationsinglassmanufacturingtechnology,wecanfabricateawiderangeofhighqualitystandardorcustom-designedglasswaferstosuittheneedsofmanyapplications. WhenyoubringyourglasswaferproductionprojecttoSwiftGlass,you’llgainaccesstothehighestqualitymaterials,themostadvancedcuttingtoolsandfinishingmachines,andoneofthemostexperiencedteamsintheindustry. GlassWaferApplications&Industries Glasswafersareusedinawidevarietyoftechnicalandindustrialapplications.Someoftheseapplicationsinclude: Microelectromechanicalsystems(MEMS)andElectronics InMEMSapplications,glasswafersareoftenusedasasubstratecarrierinthefabricationprocessforthinnersiliconwafers.MEMScomponentssuchassiliconwafershavebroadapplicationsinmicrosensor,electronics,andcomputermanufacturing. Semiconductors Glasswaferandsilicawaferusageinsemiconductormanufacturingvariesbasedondesign.Glasswafersmaybeusedasapermanentsubstratewhichremainsinthefinalproductorasatemporarysubstrateforsmallerorthinnermaterials. Biotechnology Scientistsandresearchersincreasinglyuseglasswaferstofabricatemicrofluidicchips.Borosilicatechipscanbeparticularlyusefulfortheseapplicationsbecauseoftheiraffordabilityandhighchemicalresistance. Integratedcircuit(IC)packaging Ratherthancutindividualcircuitsoutofglasssubstrate,somemanufacturersnowleavethemembeddedwithinthewaferforprotection.Durablewafer-levelpackagedICsarebecomingmorecommoninportableelectronicssuchastabletsandsmartphones. OurGlassWaferFabricationProcess Glasswaferfabricationisahighlyintricateprocessthatrequiresspecializedequipmentandmanufacturingprocedures.Tothatend,ourteamofexpertsusesthemostadvancedtechnologyavailabletocreatewafersthatmeetprecisedesignstandards.Ourwaferfabricationprocessconsistsofseveralsteps: MaterialSelection:We’llworkwithyoutodeterminethecorrectmaterialforyourdesignandusethemostconsistentsheetofglassavailabletocutflawlesswafers. Shaping:Oncetheselectedmaterialiscutwithouradvancedwaterjetglasscuttingtools,eachwaferisgroundintoanapproximatewafershape. Edging/Detailing:OurglasswaferfabricationprocessusescarefullycalibratedCNCdiamondmachinetools,andeachwaferisdelicatelymachinedtodesignspecifications. LappingandPolishing:Weuseafreeabrasivelappingprocesstodevelopappropriatesurfacesmoothnessbeforepolishingeachwaferonbothsides. Inspecting:Wafersundergoahigh-precisionlaserinspectioninacleanroomtoensurethattheyfallwithintotalthicknessverification(TTV)standards. MaterialsUsedintheGlassWaferFabricationProcess SwiftGlassbeginsourglasswaferfabricationprocesswithonlythehighestqualityglassmaterials.Whichtypeofmaterialweusedependsontherequirementsoftheparticulardesign. Thefollowingmaterialsareavailableforglasswaferfabrication: Borosilicate:Widelyknownasoneofthemostaffordableglassfabricationmaterials,borosilicateglassretainsitsstrengthandtransparencyduringexposuretohightemperatures.AvarietyofborosilicatebrandsareavailablethroughSwiftGlassfromwell-knownmanufacturerssuchasSchottandCorning. Borofloat®:Oneofthemostpopularbrandsforglasswaferfabrication,thisfloatingborosilicateglassmaterialisrenownedforitsdurabilitywhenexposedtocorrosivechemicals,itsimpressivemechanicalstrength,andremarkabletransparency. Quartz/FusedSilica:Quartzmaterialisexceptionallypureandhasanimpressivelyhighmeltingpoint.Fusedsilicawafers–alsoknownasfusedquartzwafers–areoftenconsideredidealforuseinsemiconductorcomponentsduetotheirthermalshockresistance,near-zerothermalexpansionrate,andultraviolettransparency. EagleXG®:Thisglassmaterialiscreatedwithoutmanyoftheharmfulchemicalstraditionallyfoundinelectronic/computercomponentssuchasarsenic,halides,barium,orantimony.Highchemicalresistance,lowdensity,andpristineclarityarealldistinguishingcharacteristicsofthismaterial. GlassWaferSpecificationsandCustomizations Ourhigh-techtwo-andthree-axisCNCequipmentcancutandedgetonearlyanyspecification.It’salsocompatiblewithallofthemostcommonfiletypes: AutoCAD(DWG,DWZ) BMP DXF GIF IGES JPG/JPEG MasterCam(MDX,MC8,MC9,SET) PDF STEP TIFF Withaspecialtyproductionshopandaprototypeshopatourdisposal,wecanhandlebothlowandhighproductionruns—infact,ourminimumproductionrunsizeisoneunit.Ouradvancedwaterjetcuttingtoolscancutyourchosenmaterialtowaferthicknessesdownto0.1mm,andwecanscaleoperationsbasedonyourspecificglasswaferfabricationneeds. Wealsoofferfullycustomizedglasswaferfabrication.Ourexperiencedteamwillnotjusthelpyoufabricateyourcustomdesign—they’llhelpyouperfectit.Weprideourselvesonourabilitytotakeondesignsandprojectsofanysize. Weprovideflexibilityinourglasswaferofferingsofthickness,flatness,surfacequality,andedgeprofile.Examplesofourspecificationrangeareasfollows: Fordiametermeasurements<200mm Fordiametermeasurements>200mm ForDiametermeasurements:>200mmbut<450mm Thickness: .3mm .3mmto10mm .55mmto10mm Capabilities: +/-25µm +/-25µm +/-25µm TotalThicknessVariation(TTV): <3µm <3µm <3µm SurfaceRoughness(RootMeanSquare)Average: <12Â <12Â <12Â ScratchDig: 40/20 40/20 40/20 Bow: <58µm <58µm <58µm Warp: <10µm <10µm <10µm Flatness: <1µm WhileourglasswaferandsubstratefabricationservicesaremostcommonlyusedtocreateglasswafersandsilicawafersfortheMEMSandsemiconductorsectors,ourfullycustomizableprocessesanddesigncanhandlewaferfabricationformanyindustriesandapplications. GlassWaferFabricationExperts Inover80yearsinglassfabrication,SwiftGlasshaswitnessedtheriseofmanyofthetechnologiesthatdependonglassandsilicawafers.Weproudlyparticipatedinthedevelopmentofmanyofthem.Withsuchextensiveexperience,there’snoprojectthatourknowledgeableteamcan’thandle.We’realsoISO9001:2015andITARcertified,soyoucanbesurethatwhenyouchooseSwiftGlass,ourprocessesandproductqualitywillbesecondtonone. Tolearnmoreaboutglasswaferfabricationorourotherservicesandproducts,contactusorrequestaquotetoday. Clickonthetablebelowtolearnmoreaboutourspecifications. GlassWaferSpecifications IndustryFocus Microelectromechanical(MEMS) Semiconductor PolishingProcess DoubleSided LappingProcess FixedAbrasive Materials Borofloat® EagleXG® FusedSilica Borosilicate Quartz ProductionVolume Min 1unit SpecialtyProductionShop PrototypeProduction LowVolume HighVolume FileFormats AutoCAD(DWG,DWZ) BMP-BitMappedGraphics DXF-DrawingInterchangeFormat,orDrawingExchangeFormat GIF-GraphicsInterchangeFormat IGES-InitialGraphicsExchangeSpecification,ANSIfileformat. JPGorJPEG-JointPhotographicExpertsGroup MasterCam(MDX,MC8,MC9,SET) PDF-PortableDocumentFormat STEP-StandardfortheExchangeofProductModelData TIFF-TaggedImageFileFormat OtherCapabilities Readytogetstarted? BrowseourResources! I'mlookingfor... DataSheets Tools eBooks Certifications&Standards Videos orRequestaQuoteToday EdgeGrinding&Polishing Viewmore GlassCutting&WaterjetCutting Viewmore ThermalGlassTempering&ChemicalGlassStrengthening Viewmore SurfaceLapping&Polishing Viewmore GlassWafers Viewmore GlassDrilling Viewmore GlassCNCMachining Viewmore Can'tfindwhatyou'relookingfor? ContactaglassexperttolearnmoreabouthowSwiftGlasscanhelpwithyourproject. AskaGlassExpert X HaveaquestionaboutSwiftGlass'sservices?GetinTouch